eBook - ePub
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
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- 226 pages
- English
- ePUB (mobile friendly)
- Available on iOS & Android
eBook - ePub
Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement
Book details
Table of contents
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About This Book
As demand for on-chip functionalities and requirements for low power operation continue to increase as a result of the emergence in mobile, wearable and internet-of-things (IoT) products, 3D/2.5D have been identified as an inevitable path moving forward. As circuits become more and more complex, especially three-dimensional ones, new insights have to be developed in many domains, including electrical, thermal, noise, interconnects, and parasites. It is the entanglement of such domains that begins the very key challenge as we enter in 3D nano-electronics. This book aims to develop this new paradigm, going to a synthesis beginning between many technical aspects.
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Yes, you can access Power, Thermal, Noise, and Signal Integrity Issues on Substrate/Interconnects Entanglement by Yue Ma,Christian Gontrand in PDF and/or ePUB format, as well as other popular books in Computer Science & Computer Networking. We have over one million books available in our catalogue for you to explore.
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Table of contents
- Cover
- Half Title
- Title Page
- Copyright Page
- Table of Contents
- Preface
- Acknowledgments
- Authors
- 1. General Introduction
- 2. Substrate Noise in Mixed-Signal ICs in a Silicon Process
- 3. Efficient and Simple Compact Modeling of Interconnects
- 4. Electrothermal Modeling of Substrates
- 5. Substrate Noise and Parasites: Toward 3D
- 6. General Conclusion
- References
- Index