Industrial Plasma Engineering

Volume 2 - Applications to Nonthermal Plasma Processing

J Reece Roth

• Publisher: Routledge
• Year: 2017
• ISBN:
  9781351438704
• Edition: 1
• Topic: Physical Sciences
• Subtopic: Physics
• Index: Physics

Written by a leading expert in the field, the paperback edition of Industrial Plasma Engineering, Volume 2: Applications to Nonthermal Plasma Processing provides a background in the principles and applications of low temperature, partially ionized Lorentzian plasmas that are used industrially. The book also presents a description of plasma-related processes and devices that are of commercial interest. The text is suitable for students or in-service users with a physics and calculus background at the sophomore level. These two volumes are intended to be used as textbooks at the senior or first-year graduate level by students from all engineering and physical science disciplines and as a reference source by in-service engineers.

Contents Volume 1: Principles

1    Introduction

2    Kinetic Theory of Gases

3    Motion of Charges in Electric and Magnetic Fields

4    Characteristics of Plasma

5    Electron Sources and Beams

6    Ion Sources and Beams

7    Ionizing Radiation Sources

8    Dark Electrical Discharges in Gases

9    DC Electrical Glow Discharges in Gases

10  DC Electrical Arc Discharges in Gases

11  Inductive RF Electrical Discharges in Gases

12  Capacitive RF Electrical Discharges in Gases

13  Microwave Electrical Discharges in Gases

Appendices

Preface to Volume 2

Volume 1 of this three-volume work is intended to provide a background in the principles of low temperature, partially ionized Lorentzian plasmas that are used industrially. Volumes 2 and 3 are intended to provide a description of plasma-related processes and devices that are of actual or potential commercial importance. The text assumes that the average student or practicing engineer has not recently taken a course in plasma physics, and possesses a background in physics and calculus that ended at the sophomore level. These three volumes are intended to be used as textbooks at the senior or first-year graduate level by students from all engineering and physical science disciplines, and as a reference source by practicing engineers.

Use of this second volume as a textbook or reference source assumes that the reader is familiar with the material in Volume 1, or has an equivalent background in low-temperature Lorentzian plasma physics. An introduction to plasma physics and the physical processes important in industrial plasmas is contained in the first four chapters of Volume 1. Chapters 5 through 7 of Volume 1 describe the sources of ion and electron beams and ionizing radiation that are used industrially. Chapters 8 through 10 of Volume 1 describe the physics and technology of DC electrical discharges, and chapters 11 through 13 describe the physics and technology of RF plasma sources.

In this second volume, chapter 14 is devoted to some aspects of materials science that are basic to plasma-processing applications. Chapters 15 and 16 are, respectively, devoted to atmospheric and vacuum plasma sources, chapter 17 to the plasma reactors (or plasma ‘tools’) frequently used industrially, and chapter 18 to specialized methods and devices used in these reactors. Chapter 19 is devoted to the effects of plasma-related parameters on the outcomes of plasma processing. Chapter 20 covers the most frequently used diagnostic methods to measure the independent input variables, the plasma parameters, and the results of plasma processing. Chapters 21,22,23,24 and 25 cover industrial applications categorized as non-thermal plasma processing of materials.

Volume 3 will cover thermal plasma processing and plasma devices. Chapters in this volume will cover the melting and refining of bulk materials; subsonic and supersonic plasma aerodynamics; the use of plasmas for synthetic and destructive plasma chemistry; electrical sparking, switchgear, and coronas, all important to the electric utilities; plasma lighting devices; the applications of electrohydrodynamics to electrostatic precipitation and paint spraying; and research and development plasmas with potential for industrial applications.

This second volume is not intended to be self-contained. Frequent reference is made to equations, derivations, and data discussed in Volume 1. This volume does not contain derivations from first principles of some advanced material from plasma physics or materials science. Such background can be found in other sources listed among the references at the end of the individual chapters, or in the annotated bibliography that will be included at the end of Volume 3. SI units have been used throughout the text except where conventional usage (e.g., electronvolt, Torr) has become so firmly established that non-SI units are more appropriate.

Available technical dictionaries in the fields of physics, chemistry, and electrotechnology generally have an inadequate coverage of the terminology required to discuss the subject of industrial plasma engineering. In an attempt to deal with this problem and increase the value of this book as a reference source, the technical terminology, jargon, and acronyms used in the field of industrial plasma engineering are not only defined and fully discussed, but also italicized and indexed when they first appear in the text. This practice is intended to assist the reader in learning key terminology and concepts, and should provide the practicing engineer with a provisional technical glossary until a proper technical dictionary covering the field of industrial plasma engineering becomes available.

In addition to providing an extensive index, I have attempted to further enhance the book as a reference source by including several appendices at the end of each volume, which provide both a comprehensive listing of the mathematical nomenclature and units used throughout the text, and a collection of frequently used plasma formulae, physical constants, and conversion factors. The index at the end of this second volume includes not only the technical terms used in it, but also those that were used in Volume 1.

In this second volume, which is concerned with specific industrial processing applications of plasma-related technologies, it has been necessary to use trade jargon, some of which includes copyrighted or trademarked trade names. An attempt has been made to indicate the status of such words as copyrighted or trademarked. If any such legally protected terminology has slipped through without the appropriate designation, I apologize to the trademark or copyright holder in advance.

To facilitate the use of this book for classroom instruction, I have prepared an Instructor’s Manual for both volumes for teachers of the subject, which is available from me for the cost of making a photocopy. This Manual includes homework problems and their answers; full-size copies of the figures and tables, from which transparencies can be made; enlarged originals of all the equations in the text for the production of transparencies; and a topical outline of all chapters with pagination keyed to the text.

I would like to express my appreciation to the many individuals and anonymous reviewers whose suggestions and hard work have contributed to the manuscript in its present form. While assuming total responsibility for the contents and correctness of the manuscript myself, I would like to thank my graduate and minicourse students who pointed out errors or opportunities for improvement in early drafts of the manuscripts for both volumes. I especially would like to thank Dr Brian C Gregory and Dr Donald L Smith for their very thorough and helpful review of Volume 1, and I would also like to thank Ms Roberta Campbell who typed the original and most of the later drafts of the manuscript for both volumes, Ms Jenny Daniel, who drafted nearly all the figures in Volume 1, and Mr James Morrison, who drafted the figures in Volume 2.

Finally, I am desirous of establishing contact with the instructors, students, and in-service professionals who use this book in order to improve it, correct it, and answer any questions. Please feel free to contact me with any corrections or comments at (865)-974-4446 Voice, 865-974-5492 FAX (USA); or by e-mail at [email protected].

J Reece Roth, PhD

Weston Fulton Professor of Electrical Engineering

University of Tennessee

Knoxville, Tennessee

17 January, 2001

14

Surface Interactions in Plasma Processing

Volume 1 describes the basic principles of low-temperature, Lorentzian, partially ionized plasmas used industrially. This second volume is concerned with industrial processes that use plasmas or plasma-related technologies in applications that have come to be known as industrial plasma processing. The first seven chapters of this volume cover fundamentals from materials science, the physics of plasma sources, plasma reactor technology, the kinetic theory and plasma physics of processing plasmas, and diagnostic procedures from the fields of plasma and materials science. The applications to non-thermal plasma processing described in the remaining five chapters have been organized in order of increasing interaction/modification of the surface of the material.

14.1 INDUSTRIAL PLASMA PROCESSING

In this chapter, we consider some basic physical processes from the field of materials science that are of importance in plasma-processing applications.

14.1.1 Industrially Significant Plasma Characteristics

Plasmas are industrially useful because they possess at least one of two important characteristics. The first characteristic is a high power or energy density. Examples include DC electrical arcs or RF inductive plasma torches, in which the plasma power density can range from 100 W/cm³ to above 10 kW/cm³. Such plasmas are in or near thermodynamic or thermal equilibrium, and are used for thermal plasma processi...

Table of contents

• Cover
• Half Title
• Title Page
• Copyright Page
• Table of Contents
• Contents, Volume 1: Principles
• Preface to Volume 2
• 14 Surface Interaction in Plasma Processing
• 15 Atmospheric Pressure Plasma Sources
• 16 Vacuum Plasma Sources
• 17 Plasma Reactors for Plasma Processing
• 18 Specialized Techniques and Devices for Plasma Processing
• 19 Parametric Plasma Effects On Plasma Processing
• 20 Diagnostics for Plasma Processing
• 21 Plasma Treatment of Surfaces
• 22 Surface Modification by Implantation and Diffusion
• 23 Thin-Film Deposition by Evaporative Condensation and Sputtering
• 24 Plasma Chemical Vapor Deposition (PCVD)
• 25 Plasma Etching
• Appendices
• Index