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Computer Integrated Electronics Manufacturing and Testing
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About This Book
Describes this process at it relates to the electronics industry, focusing on such areas as printed wiring boards, networking, automatic assembly, surface mount technology, tape automated bonding, bar coding, and electro-static discharge. Also studies the effects of group work ethics as a factor in
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1
The Printed Wiring Board (FWB) in Electronics Manufacturing
1.1 INTRODUCTION
The printed wiring board (PWB) is an important component of electronic assemblies. Historically, it has been regarded more as a mounting medium for electrical components: a platform through which they could be interconnected. In the evolution of electronic circuits, however, other considerations such as faster operation, higher reliability, and intense competition require the components to be closer together, more densely populated, and to provide a greater number of input/output (I/O) connections. Higher frequencies and narrower line widths and spacings soon require greater attention to board parameters such as line capacitance, controlled impedance, and heat dissipation.
It is appropriate, therefore, to begin this volume with a study of the design, construction, and operation of the PWB in order to better understand its role in computer-integrated electronics manufacturing and testing. For example, at higher operating frequencies, the PWB becomes more and more a microwave component and more information is needed on such topics as:
- Skin effect (high-frequency fields forcing current to flow more on the outside of a conductor)
- Signal integrity: the effects of crosstalk, noise, coupling, and line capacitance on the desired signal quality
- Standing wave ratios (SWRs) and multiples of wavelength for impedance matching and line loss measurements
- Time domain reflectometry (TDR): a test method for Quantifying the high-frequency characteristics of a bare board
For details on the aÄŒbpve topics, see the chapter entitled âManufacturing Test,â under the sections entitled âBare Board Testâ and âDynamic High Speed Functional Test.â
In this chapter, therefore, the PWB in electrorĂifĂáșž manufacturing will be viewed not only as a component in the assembly process jbtii áșĄÄŒso as a qualified mechanical and/or electrical/electronic component in the selection and testing process.
1.2 HISTORICAL PERSPECTIVE ON PRINTED WIRING BOARDS
The PWB was preceded by the sheet metal (usually aluminum) chassis on which all electrical and electronic components were tediously bracketed, socketed, screwed down, and individually hand-wired, trimmed, and soldered. As the age of plastics matured in parallel with electronics, designers found it convenient and desirable to use sheets of insulation (known as âboardsâ) such as Bakelite, and later, glass-epoxy resins such as G10 and FR4. In the late 1950s a variety of precut and predrilled boards became available, gradually replacing the aluminum chasses. Cutting devices for the glass-epoxy boards were developed for socket holes of vacuum tubes and transistors. A general-purpose rectangular matrix of predrilled holes evolved, which inspired the design of the dual in-line planar (DIP) rectangular integrated circuit (IC) packages and their appropriate sockets. Wherever possible, the IC package pins were spaced to align conveniently with the rows of holes in this substrate, thus minimizing the need for separate socket cutouts.
The demand for greater board performance increased the component population density, and hand-wired interconnection was soon obsolete. It was, in fact, the impossible attempts to hand-wire densely interconnected circuits which gave rise to the expression âratâs nest.â In addition, the high numbers and density of the wiring created defects in the correctness and quality of connections, which, in turn, decreased the reliability of the equipment which it connected. The PWB was conceived to relieve these high-density wiring and reliability problems with the added advantages of consistent, high-quality, and more economical high-volume reproduction of connections. With the advent of the PWB, it became necessary to replace wires with etched copper foil and then to preplan the routing of these conductors carefully.
The physical layout of the board was developed by placing a large sheet of paper or vellum (usually with a much larger scale than the intended circuit) on at translucent glass âlight table.â By todayâs standards, the physical layout áșˤ öf low density (only a Ă. 125-inch grid or greater). The designer routed the connections of an initial placement of components (resistors, capacitors, sockets, arid connectors) by inking tn the connection lines in black. It later became more effĂÄĂź&ftf tĂł lay down precut Widths of black pressure-sensitive tape on the vellum. The ĂigM iĂ«Ăšfe allowed the designer to see both sides of the layout and routing simultaneously, thÄ labyrinth of lines swept slowly across the table as the designer laid the tape according to the desired connections between preplaced component holes. Indeed, as the requirement for Ă€ ÄfĂ«ÄÂœf number of lines per unit area increased, physical limitations in laying narrow tĂ€pÄ widths constrained the process. This, in parallel with the development of computer-aided tools, began the higher grid density trend from 0.125 to 0.100 inch and smaller. A benefit of these advances was to shorten design and development time. A new technology emerged with the ability to route circuit paths in the samÄ plane without intersecting and causing short circuits. Routing was modified as necessary by simply removing the tape and relocating it if interference or intersection problems were encountered. Occasionally, the designer rĂȘĂ„Ă©hed an impasse and could not make the connection without intersecting another circuit pĂ€Ăh, In this case, small yellow-colored wires were physically added and soldered as jumpers over the difficult intersection. Later, this technique would serve as a method of changing circuit paths when engineering change orders (ECOs) were initiated. An appreciation of the ratâs nest wiriflg problem can be experienced by manufacturing engineers who are often burdened with 50 to 100 ECO wires on a PWB.
On the other side of the PWB layout drawing, components were relocated to facilitate the routing process. The large vellum was then photographically reduced to the required physical size and the image was transferred to a copper-clad board. Thus, masked like a stencil on the copper foil, the excess copper was chemically etched away, leaving an outline of the needed interconnections. This process, although now more sophisticated, is still in use to produce PWBs.
The routing of conductors today is performed by sophisticated, computer-assisted autorouters. The density of PWB lines is expressed in conductor width and spacing; for example, â8/12â means an 8-mil (0.008 inch) conductor width and 12-mil (0.012 inch) spaces between conductors. In this volume, âmilá»s]â refers to the linear dimension of âthousandth[s] of an inch.â âFine lineâ densities of 5/5, 2/3, or even smaller are becoming commonplace.
Incidentally, the term routing in PWBs has two different meanings. In the present context, âroutingâ refers to the process of laying out routes of the interconnection paths. Another meaning, which is used later, refers to âroutingâ in the sense of cutting or friilling, as when a PWB outline is mechanically cut out from a larger piece of panel as described in the section entitled âPWB Construction and Assembly.â
Historically, the etched circuit board was called a printed circuit board (PCB). The name was appropriate as the printing of circuitry resembled the printing of text and graphics in the classical sense. As the process evolved into the use of photolithography techniques, the terminology of PCB ƔÀƥ even more appropriate. There are those, however, who object to the word âcircuitâ in PCB on the grounds that the etch of a bare board is not the (complete) circuit, but merely the âwiringâ or interconnectioĂŻls of that circuit. As such, it is claimed, the bare board with its ÄttĂŻied pattern is more correctly a PWB and not a PCB. Of course, there Ă„re techniques to âprintâ entire circuits on a substrate (base material like a board, ceramic wafer, or silicon support [see list of definitions]), including connections (wiring), resistors, capacitors, inductors, and semiconductors. See also the appendix entitled âBackground on Screen Printing: Thick Film Circuits.â This special class would then qualify as a PCB under the more stringent definition described above.
In keeping with this discussion, then, all references in this book will be to the PWB, which represents the board on which a circuit wiring or connection pattern is printed, or, in the multilayer case, within the construction as well. Contrary to popular belief, printed wiring and printed circuit techniques are identical.
There is another process which âtacksâ fine-diameter circuit wire to the surface of a board in a commercial technique known as Multiwire. Because the stitched wire is also coated with insulation, it is possible to cross or intersect wires on the same side of a barÄ board. This Multiwire technique is distinguished from the âprinted wireâ technique by defining an identicality between printed circuits and printed wiring as described above.
For completeness, the following is a partial list of other terms used for:
- Bare board with printed circuit etched:
- card
- bare board
- circuit card
- circuit board
- second level interconnect package (with TAB being first level interconnect, for example) (see the chapter entitled âSurface Mount Technology (SMT) and Tape Automated Bonding (TAB)â
- Printed wiring board with components added:
- populated PWB (or PCB)
- assembled PWB (or PCB)
- module
- PWB (or PCB) assembly
- printed wiring assembly (pwa)
- card assembly
- populated board
- assembled board
- loaded board
- stuffed board
1.3 DESIGN OF THE PRINTED WIRING BOARD FOR MANUFACTURING
When a board is to be manufactured, the drawings are generated in the modern factory from the CAD workstation (see list of definitions and Reference 1-01). The data base contains the relevant design and manufacturing parameters from a series of customer specifications. As the documentation and data are compiled, the ...
Table of contents
- Cover
- Half Title
- Series Page
- Title Page
- Dedication Page
- Preface
- Acknowledgments
- Contents
- Introduction
- Chapter 1 The Printed Wiring Board (PWB) in Electronics Manufacturing
- Chapter 2 Solder and Automated Soldering Processes
- Chapter 3 Automated Assembly Techniques
- Chapter 4 ESD (Electrostatic Discharge)
- Chapter 5 Bar Coding and Other Marking Systems
- Chapter 6 Manufacturing Test
- Chapter 7 Computer-Assisted Repair
- Chapter 8 Networking for Electronics Manufacturing
- Chapter 9 Surface Mount Technology (SMT) and Tape Automated Bonding (TAB)
- Chapter 10 Artificial Intelligence and Expert Systems in Manufacturing
- Chapter 11 Kaisha and Electronics Manufacturing
- Chapter 12 Waves of Opportunity
- Appendix A Contamination Problems of Pwbs During Manufacturing and Test
- Appendix B Intermetallic Formation in Solder Processing
- Appendix C Background on Screen Printing: Thick-Film Circuits
- Appendix D List of Abbreviations
- Appendix E List of Definitions
- Index