Compatibility and Testing of Electronic Components
eBook - PDF

Compatibility and Testing of Electronic Components

  1. 354 pages
  2. English
  3. PDF
  4. Available on iOS & Android
eBook - PDF

Compatibility and Testing of Electronic Components

Book details
Table of contents
Citations

About This Book

Compatibility and Testing of Electronic Components outlines the concepts of component part life according to thresholds of failure; the advantages that result from identifying such thresholds; their identification; and the various tests used in their detection. The book covers topics such as the interconnection of miniature passive components; the integrated circuit compatibility and its components; the semiconductor joining techniques; and the thin film hybrid approach in integrated circuits. Also covered are topics such as thick film resistors, conductors, and insulators; thin inlays for electronic applications; and humidity corrosion of metallic resistors. The text is recommended for electrical engineers who would like to know more about electrical components, especially those who are interested in the fields of thin films and integrated circuitry.

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Information

Publisher
Butterworth-Heinemann
Year
2016
ISBN
9781483103358
Topic
Technology & Engineering
Subtopic
Mechanical Engineering
Index
Technology & Engineering

Table of contents

  1. Front Cover
  2. Compatibility and Testing of Electronic Components
  3. Copyright Page
  4. Table of Contents
  5. Preface
  6. Chapter 1. Introduction
  7. Chapter 2. Integrated Circuit Compatibility
  8. Chapter 3. Survey of Semiconductor JoiningTechniques
  9. Chapter 4. Commercial Application of Thick Film Hybrids
  10. Chapter 5. Thin Film Hybrid Approach toIntegrated Circuits
  11. Chapter 6. Factors affecting thick film devices
  12. Chapter 7. Adhesion of platinum-goldglaze conductors
  13. Chapter 8. Thin inlays for electronicapplications
  14. Chapter 9. Humidity corrosion of metall icresistors
  15. Chapter 10. The interface between glaze resistors
  16. Chapter 11. Confusion in Multilayer Systems
  17. Chapter 12. Dielectric formulations for Screened Ceramic Microcircuit Substrates
  18. Chapter 13. Failure modes in thin film circuits
  19. Chapter 14. Specifying resistance temperature stability
  20. Chapter 15. Poly—para—xylylene in thin film applications
  21. Chapter 16. Thin film Al—Al2O3—Al capacitors
  22. Chapter 17. Compatible fabrication of tantalumthin film integrated circuits
  23. ChapĂ­er 18. Silicon oxide micromodule capacitors
  24. Chapter 19. Chip capacitors in hybrid microelectronics
  25. Chapter 20. Design, construction and testing of miniature relays
  26. Chapter 21. Compatibility of flexible film wiring
  27. Chapter 22. The purpose of testing
  28. Chapter 23. Reliability screening using infrared radiation
  29. Chapter 24. Environmental and lifetest ingofmagnet iccomponents
  30. Chapter 25. Searching for incompatibility in integrated circuits
  31. Chapter 26. Encapsulated component stress testing
  32. Bibliography
  33. Index