American Microelectronics Data Annual 1964–65
eBook - PDF

American Microelectronics Data Annual 1964–65

  1. 960 pages
  2. English
  3. PDF
  4. Available on iOS & Android
eBook - PDF

American Microelectronics Data Annual 1964–65

Book details
Table of contents
Citations

About This Book

American Microelectronics Data Annual 1964-65 provides comprehensive information on different microelectronics available in the U.S. The microelectronics covered in the text includes thin film, semiconductor, and integrated and hybrid circuit assemblies. The selection also provides an index that can be utilized for locating assemblies by the virtue of circuit function or design category. Information on the techniques essential in the practice of microelectronics is also included. The book will be of great use to student and professional electronics engineers and technicians.

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Yes, you can access American Microelectronics Data Annual 1964–65 by G. W. A. Dummer,J. Mackenzie Robertson in PDF and/or ePUB format, as well as other popular books in Tecnología e ingeniería & Ingeniería mecánica. We have over one million books available in our catalogue for you to explore.

Information

Publisher
Pergamon
Year
2014
ISBN
9781483185491
Topic
Tecnología e ingeniería
Subtopic
Ingeniería mecánica

Table of contents

  1. Front Cover
  2. American Microelectronics Data Annual 1964-65
  3. Copyright Page
  4. Table of Contents
  5. PREFACE
  6. CHAPTER 1. AEROJET-GENERAL Microwelder Mark ll
  7. CHAPTER 2. AEROTRONIC ASSOCIATES Model 470 Micro Logic Life/Aging System
  8. CHAPTER 3. ALPHA MICROELECTRONICS Custom Facilities
  9. CHAPTER 4. AMELCO Integrated Microcircuits
  10. CHAPTER 5. AUTONETICS Microelectronics
  11. CHAPTER 6. BENDIX : The Bendix Semiconductor Division Approach to Monolithic Microcircuits. Program - Steps of Fabrication - Tentative specifications for active slices (amplifier and switching)
  12. CHAPTER 7. BUNKER-RAMO Thin-Film Hybrid Microcircuits
  13. CHAPTER 8. BURROUGHS : Thin Film Memory Planes. Introduction - Behavior of thin film memory elements - Thin film operating characteristics- Product information (thin film memory planes BIP-1000 and BIP-1001) - Applications information (noise-magnetic shielding - the transformer-diode matrix - current drivers - the information driver - the sense amplifier)
  14. CHAPTER 9. CENTRALAB 'PEC' Packaged Electronic Circuits
  15. CHAPTER 10. CONSOLIDATED REACTIVE METALS : Semiconductor alloy data
  16. CHAPTER 11. CTS Cermet Microminiature Modules
  17. CHAPTER 12. FAIRCHILD: Characteristics and Applications of Micrologic Elements Introduction-Choice of circuit and characteristics of DCTL-Micrologic elements - Applications of Micrologic elements-Counters - Shift registers - Full adders - Code conversion-Two's and nine's complementers -Reclocking circuit-Some considerations on integrated circuit assembly techniques -Reliability considerations - Conclusions - References
  18. CHAPTER 13. GENERAL INSTRUMENT: 'Multichip' technique. General description -Active device parameters - Resistors - Capacitors - Construction layout - Design procedure - Functional tests - Reliability test
  19. CHAPTER 15. GENERAL MICRO-ELECTRONICS Integral Logic Circuits
  20. CHAPTER 16. HAMILTON STANDARD Microminiature Electronics
  21. CHAPTER 17. HONEYWELL Integrated Circuits
  22. CHAPTER 18. HUGHES Integrated Circuits
  23. CHAPTER 19. INTELLUX Microcircuit Logic Modules
  24. CHAPTER 20. IRC Hybrid Microcircuits : Advantages, Characteristics, Construction.Introduction - Advantages - Types of microcircuits - When to use a hybrid microcircuit - Design and construction ofhybrid microcircuits - Testing and quality control - Application engineering services
  25. CHAPTER 21. KEUFFEL AND ESSER "Cut 'n' Strip" Film for Microcircuit Masters
  26. CHAPTER 22. KULICKE AND SOFFA Component Mounting Machine, Model 146
  27. CHAPTER 23. MALLORY Pellet Circuit Assembly Techniques : Introduction - Multiple pellet interconnections - X, Z, XY, XZ and XYZ packs
  28. CHAPTER 24. MANN Continuous Process Photomask System : General - Economy -Security - Quality - Steps in preparation of masks
  29. CHAPTER 25. MELPAR Semiconductor Integrated Circuits
  30. CHAPTER 26. MOTOROLA 'MECL' Integrated Circuits
  31. CHAPTER 27. ( * MECL type )
  32. CHAPTER 28. MYCALEX 'Supramica' Flat Packages for Integrated Circuits
  33. CHAPTER 29. OPTIMIZED DEVICES Integrated Circuit Test System, Model 2500
  34. CHAPTER 30. PHILCO Custom Hybrid Thin-Film Circuits
  35. CHAPTER 31. RAYTHEON: Shift Registers Using Integrated NOR gates
  36. CHAPTER 32. RCA: General Information on RCA Micromodules. Typical microelements-Micromodule construction and geometry- Advantages of micromodule construction - examples of construction- environmental tests
  37. CHAPTER 33. RCA Developmental type micromodules
  38. CHAPTER 33. SIGNETICS: Integrated Circuits - General Data
  39. CHAPTER 34. SOLID STATE ELECTRONICS Series 2000 'Micromods'
  40. CHAPTER 36. SPRAGUE Microelectronics : General - Semiconductor integrated circuits- thin-film integrated circuits - microminiature assemblies
  41. CHAPTER 37. SYLVANIA Integrated Circuits
  42. CHAPTER 38. TEKTRONIX Digital Readout System, Type S-3101
  43. CHAPTER 39. TEXAS INSTRUMENT Semiconductor Networks
  44. CHAPTER 40. VARO: Design Considerations for Thin-Film Microcircuits. Introduction- Conversion and design criteria - Actual circuit conversion - The Microbloc concept - Summary
  45. CHAPTER 41. VECTOR Hybrid Thin-Film Integrated Circuits
  46. CHAPTER 42. WELLS ELECTRONICS 'Weltek' Miniwelder, Model 500
  47. CHAPTER 43. WESTINGHOUSE: Molecular Circuits, Applications and Design Considerations. Introduction - Equivalent Circuit parameters for functional blocks - Typical applications of functional electronic blocks - Molecular electronics interconnection techniques - Reliability - State of the art
  48. CHAPTER 43. Westinghouse Flat-Pake for Functional Electronic Blocks. Introduction - Flat-Pak design considerations - Flat-Pakstructure - Flat-Pak manufacturing procedures - Functional Electronic Block encapsulation procedures - Environmental data - Package types