Handbook of Wafer Bonding
Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo, Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo
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Handbook of Wafer Bonding
Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo, Peter Ramm, James Jian-Qiang Lu, Maaike M. V. Taklo
Über dieses Buch
The focus behind this book on wafer bonding is the fast paced changes in the research and development in three-dimensional (3D) integration, temporary bonding and micro-electro-mechanical systems (MEMS) with new functional layers. Written by authors and edited by a team from microsystems companies and industry-near research organizations, this handbook and reference presents dependable, first-hand information on bonding technologies. Part I sorts the wafer bonding technologies into four categories: Adhesive and Anodic Bonding; Direct Wafer Bonding; Metal Bonding; and Hybrid Metal/Dielectric Bonding. Part II summarizes the key wafer bonding applications developed recently, that is, 3D integration, MEMS, and temporary bonding, to give readers a taste of the significant applications of wafer bonding technologies. This book is aimed at materials scientists, semiconductor physicists, the semiconductor industry, IT engineers, electrical engineers, and libraries.
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Inhaltsverzeichnis
- Cover
- Related Titles
- Title page
- Copyright page
- Preface
- Obituary
- List of Contributors
- Introduction
- Part One: Technologies
- Part Two: Applications
- Index